Kingboard Laminates are our main FR-4 raw material supplier.

Kingboard Laminates supply FR-4 raw material for us. Standard FR-4 (Tg140),High TG ≥200℃

If there are time constraints during PCB processing, multiple PCB layers, high welding temperature (≥230℃), high working temperature (above 100℃), or significant welding thermal stress (such as wave soldering), it is advisable to select a high Tg plate.

Application

Communication,Automotives,Industry Control,5G Base Station,LED

Bergquist and Ventec are our main Metal core PCB raw material supplier,such as aluminum core raw material ect. 

Thermal Clad is a cost-effective solution which can eliminate components, allow for simplified designs, smaller devices and an overall less complicated production processes. Additional benefits of Thermal Clad include lower operating temperatures, longer component life and increased durability.

Bergquist Thermal Clad substrates are not limited to use with metal base layers. In one example, power conversion applications can enhance their performance by replacing FR-4 with Thermal Clad dielectrics in multi-layer assemblies. In this application, the thickness of the copper circuit layer can be minimized by the high thermal performance of Thermal Clad.

Thermal Clad is a complete thermal management system, unlike traditional technology which uses heat sinks, clips and other mounting hardware. Thermal Clad enables low-cost production by eliminating the need for costly manual assembly

We purchase Chin-Shin raw material from Taiwan.

Features

·Excellent heat sink, and good electrical insulation.
·High mechanical strength, dimensional stability etc.
·Apply to the Surface Mount Technology (SMT).
·Reduce the temperature of product and extend the life of product.

Application

Lighting: General LED lighting.

Electronic devices in automobile : lgnition device,voltage regulator ,auto safety control system, AC converter.

Power supply: Switch regulator ,switch,DC-DC converter,DC-AC converter,MEGA power supply,solar power board.

Electronic control : Relay ,transistor base ,switchboard,radiator,insulating conductive board in semiconductor,motor control device.

Computer devices : Power supply device,soft disk driver,CPU.

Communication : Automobile telephone, high frequency booster mobile telephone,circuit filter,transmitting circuit.

FR-4 PCB Materials

Most printed circuit boards are manufactured using glass-reinforced epoxy laminate as the substrate. While there are a wide variety of laminates available on the market, FR-4 is both versatile and well-accepted as a standard material for PCB manufacture. FR-4 functions well as an electrical insulator, and has a good strength-to-weight ratio, and is flame resistant.
The standard FR-4 material that is used in our products is a high temperature, high Td, low CTE 150Tg material.  

If a higher Tg material is required, we do stock a 170Tg version of our standard FR-4 material as well, that can be selected in the quoting process.  

Note: The 170Tg FR-4 material has equivalency for electrical and mechanical properties with the popular Isola 370HR material, and functions very similarly. There is one documented physical difference, Isola's 370HR is listed as a 180Tg material.  

Glossary:

Dielectric Materials
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.  

Pre-impregnated (Pre-preg)
Contraction of "pre-impregnated composite fibers", and in the manufacture of PCBs, pre-pregs help influence the performance characteristics of the printed circuit board.


A term also used in the PCB fabrication industry to describe the bonding ply materials used to bond the layers of a multilayer PCB together.