E-mail:sales@scmcpcb.com
Website :www.scmcpcb.com
Skype:sc.mcpcb
No minimum order quantity
XRF test data
Solderability test
Impedance modelling/testing
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Items |
Descriptions |
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1. IQC |
Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products |
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2. IPQC |
In-process quality control, Every process on line sampling inspection |
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3. Chemical analysis |
Chemical analysis to control on line chemical solution within control range |
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4. Physical Laboratory |
To do reliability test and outgoing inspection items |
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5. Micro-section |
To analysis defects, every layer structure thickness, solder mask thickness, surface and PTH copper thickness |
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6. Black Light inspection |
To analysis the PTH hole copper coverage before Panel copper plating |
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7. Lamination thickness measurement |
To control the product thickness quality even distribution and thickness tolerance under control |
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8. L/S measurement control by 3D |
To control the products after Pattern plating within the design spec. ( Line width and Space width) |
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9. CMI measure copper thickness |
CMI help to measuring the PTH hole copper thickness and no need to damage the board by micro-section |
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10. Impedance measurement |
For measuring Impedance control products ( Single strip, Differential …) |
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11. Peel strength test |
Testing Solder Mask adhesive |
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12. X-ray monitor multi layer drilling |
It control inner and outer layer registration |
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13. Hole AOI |
To check hole location compare with Gerber design location accurace |
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14. XRF measure Nickel & Gold thickness |
To measuring surface finishing metal thickness |
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15. Hi-Pot test |
To checking dielectric insulation capability |
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16. 100% O/S test |
To checking circuit normal function as design circuit |
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17. Hole counter |
To check missing hole, hole size out spec., no excess holes |