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34 Layers High Layer Count PCB
▪ Layer count ——34L
▪ Material —— S1000 - 2
▪ Board thickness —— 4.6mm
▪ Aspect Ratio —— 18:1
▪ Blind vias —— L32 – L34
▪ Internal Cu —— 1 & 2 oz
▪ Min. LW/LS —— 0.1mm
▪ Min. Drill Size —— 0.25/0.4mm
▪ Impedance —— More than 20 impedance lines
▪ Surface Finish —— ENIG

20 Layers High Layer Count PCB
▪ Layer count —— 20L
▪ Material —— IT180ATC
▪ Board Thickness —— 2.35±0.1mm
▪ Copper thickness —— 0.5OZ
▪ Min. LW/LS —— 0.072/0.255mm
▪ Min. hole Size —— 0.131mm
▪ Surface Finish —— ENIG+Hard gold finger
▪ Application field —— Communication
2 Level HDI 24 layers PCB
▪Layer count —— 24L
▪Material —— FR-4(Tg180) VT-47
▪Board thickness —— 2.59+/-0.26mm
▪Min. LW/LS —— 3.5/5.0mil
▪Min. Drill Size —— 0.25mm
▪Surface Finish —— Immersion gold
. Aluminum PCB
> Common Aluminum PCB
> COB Aluminum PCB(Chip On board Aluminum PCB)
> Mirror Aluminum PCB
. Copper PCB
Common Copper PCB
COB Copper PCB
Supper Pillar
. Iron PCB
As Metal Core PCB means the base material for PCB is metal, not normal FR4/CEM1-3, etc, and currently the most common metal used are Aluminum, Copper alloy and Iron. Aluminum has good heat transfer and dissipation ability, but yet relatively cheaper. On the other hand, copper has even better performance but relatively more expensive. We will tell you more info about Iron PCB in our Iron PCB introduction. Therefore, majority of MCPCB are made of aluminum.
MCPCB Construction
A simple one layer MCPCB has 3 layers, the copper circuit layer, thermally conductive dielectric layer, and the metal core base layer. These three layers are then laminated together. The lamination technique bonds the three layers together providing a path for the heat to dissipate.
Metal Core Layer
This layer can be made out of aluminum,copper or iron.Aluminum is the most common due to its cost,
weight and thermal characteristics. Typical thickness for aluminum is 0.4mm to 5.0mm and typical
aluminum alloys used are: AL6061, AL5052,
AL1370, AL770, and AL710. In some cases where heat dissipation takes priority over cost, copper is
used for the base layer.
Typically a heat sink is attached to the metal base to further dissipate heat away from the components.
Dielectric Layer
The dielectric layer is the most important layer in a MCPCB because it must maintain electronic insulation
while also being
thermally conductive. The dielectrics thickness plays an important role because it must be thick enough
so the copper circuit
does not short out, yet thin enough to maintain high thermal performance. Typical thickness of this layer is
between .075mm to .2mm (.003” - .008”). Thicker or thinner layers can be used depending on voltage and current.
Copper Circuit Layer
This layer is a traditional PCB circuit. The thickness can be anywhere between 35µm to 350µm (1-10 oz/ft2).
A green,white or black solder mask coating covers the entire board to protect the circuit.
Unlike PCBs a thicker copper layer can be used if the circuit requires higher current.